The South Korea 3D IC Market Size is Anticipated to Hold a Significant Share by 2033, Growing at a CAGR of 14.9% from 2023 to 2033. Three-dimensional ICs are integrated circuits that have two or more layers of circuitry within one package. The layers are interconnected both vertically and horizontally. These multi-layer chips are usually fabricated by manufacturing individual layers and then stacking and thinning them. It has developed, manufactured, and commercialized 3D integrated circuits in the market.