Global Molded Interconnect Device Market – Industry Trends and Forecast to 2032

The Molded Interconnect Device (MID) market focuses on integrating electronic circuit traces directly onto three-dimensional plastic components. This technology allows for compact, lightweight, and multifunctional device designs, benefiting industries such as consumer electronics, automotive, medical devices, and telecommunications. MIDs reduce the need for separate circuit boards and wiring, enhancing product durability, assembly efficiency, and design flexibility. Advances in laser direct structuring (LDS) and materials science are driving innovation in this field, enabling greater miniaturization and the development of complex electronic assemblies.